Qualcomm and MediaTek are set to bring new SoC in the coming weeks. Now, a new leak has surfaced on the internet, disclosing the expected launch timeframe for both these chipsets.
Snapdragon 7 Gen 3 and Dimensity 8300 Launch Timeframe
As per the realible tipster WHY LAB, both chipsets are set to debut within the next two weeks. There is speculation that the Honor 100, scheduled for debut on November 23 in China, will be the first phone to incorporate the Snapdragon 7 Gen 3 chip.
On the other hand, the Redmi K70e seems to be a likely candidate to feature the Dimensity 8300 chipset.
Qualcomm Snapdragon 7 Gen 3 Specifications (Expected)
The Snapdragon 7 Gen 3 is said to be designed with the same 1+3+4 architecture as its predecessor, comprising one prime core, three performance cores, and four efficiency cores. The prime core is purportedly clocked at 2.63GHz, with the performance cores potentially running at 2.4GHz. Meanwhile, the efficiency cores are expected to have a clock speed of 1.8GHz. An ARM Cortex-A715 could power this configuration.
The SoC is expected to carry the model number SM7550. The leak indicates that the Snapdragon 7 Gen 3, being developed using TSMC’s 4nm process, is currently under testing and is anticipated to be paired with the Adreno 720 GPU.
